Description: Brand New Sn42Bi57.6Ag0.4 138 Low Temp Tin Lead-Free Solder Paste, No-Clean Tin Paste, Solder Paste For PCB/IC/BGA/SMD CELLPHONE CPU Repairing(30G Manufacturer model: XG-Sn42Bi57.6Ag0.4 Essmetuin Lead-Free Solder Paste Content: Alloy Tin 42% Bi 57.6%Ag0.4%, Solder Flux Content: 10.8%Lead-Free Solder Paste - Low Temperature Solder Paste With Flux, Melting Point: 138 C (280.4F),Suitable For Paper Boards Or Soft Boards That Cannot Withstand High Temperatures, Special Welding Of Small Components.Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During WeldingWidely Used In BGA /SMD Circuit Board,Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors, Lighting, Connectors, ,SMT MaintenanceThe Post Soldering Transparent Residues Are Non-Conductive, Non-Corrosive And Highly Insulated Description Shipping and Handling Please allow 5-7 business days for the package to arrive, regardless of buyer location within the US. We will provide an online tracking number to you once the item has been shipped. It may take a few business days for our automated system to process the tracking number onto eBay. However, this will not affect the shipping times. Return Policy All our products are brand new and sealed. All items qualify for returns within 30 days of receipt. Feedback We take our reputation seriously. If you have any questions or concerns, please contact us and we will respond back to your message within 24 hours.
Price: 31.32 USD
Location: Within United States
End Time: 2024-03-13T20:39:08.000Z
Shipping Cost: 0 USD
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Item Specifics
Return shipping will be paid by: Seller
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Return policy details:
EAN: 0796520309579
MPN: XG-Sn42Bi57.6Ag0.4
UPC: 796520309579
Size: T4-30G
Brand: Essmetuin
